Ronetix RNX-iMX93-OSM is a solderable System-on-Module in the Open Standard Module (OSM) Size-L format, 45 x 45 mm, built on the NXP i.MX93. Two Arm Cortex-A55 cores at 1.7 GHz, an Arm Ethos-U65 microNPU (0.5 TOP/s), a Cortex-M33 at 250 MHz and the EdgeLock secure enclave sit on an LGA 662 package that is soldered straight onto your board, with no connectors to loosen under vibration. Pertech is a Ronetix distributor.
RNX-iMX93-OSM highlights
- NXP i.MX93: dual Arm Cortex-A55 at 1.7 GHz plus Arm Cortex-M33 at 250 MHz
- Arm Ethos-U65 microNPU, 0.5 TOP/s
- EdgeLock secure enclave for security functions
- 1 GiB LPDDR4X (up to 2 GiB), 4 GiB eMMC (up to 64 GiB)
- 1080p60 MIPI-DSI, 720p60 LVDS and 1080p60 MIPI-CSI
- Optional Wi-Fi 6 and Bluetooth 5.0
- Ronetix supplies Yocto, a Linux kernel and U-Boot for this module.
- OSM Size-L LGA 662: soldered like a large chip, no board-to-board connectors
Where the RNX-iMX93-OSM fits
- Compact, vibration-resistant industrial devices
- Cost-sensitive volume products that want a standard module
- Secure IoT nodes with on-device ML
- HMI and control units with LVDS or MIPI-DSI displays
Key Specifications
| Spec | Value |
|---|---|
| Model | RNX-iMX93-OSM |
| Form factor | OSM Size-L, 45 x 45 mm, LGA 662, solderable |
| Processor | NXP i.MX93: 2x Cortex-A55 1.7 GHz, Cortex-M33 250 MHz |
| AI | Arm Ethos-U65 microNPU, 0.5 TOP/s |
| Security | EdgeLock secure enclave |
| Memory | 1 GiB LPDDR4X (up to 2 GiB); 4 GiB eMMC (up to 64 GiB) |
| Display | 1080p60 MIPI-DSI (4-lane), 720p60 LVDS (4-lane) |
| Camera | 1080p60 MIPI-CSI (2-lane) |
| Network | 2x RGMII 10/100/1000; Wi-Fi 6 and Bluetooth 5.0 optional |
| I/O | 6x USB 2.0 (4 via hub), up to 5x UART, SD/SDIO, 2x SPI, 2x I2C, 2x CAN, up to 4x PWM, GPIO |
| Supply | 5.0 V |
| Software | Yocto, Linux kernel, U-Boot |
| Carrier board | RNX-OSM-CARRIER |
| Operating temperature | 0 to +70 °C; -40 to +85 °C optional |
| Relative humidity | 10% to 90% |
| MTTF | More than 200,000 hours |
Frequently asked questions
What is the RNX-iMX93-OSM?
It is a Ronetix solderable System-on-Module in the OSM Size-L format with the NXP i.MX93 processor.
What is OSM?
Open Standard Module is a standard for small solderable modules. The module is an LGA package that is soldered onto the carrier like a large chip, so no board-to-board connectors are needed.
How do I develop with an OSM module before soldering it?
Use the RNX-OSM-CARRIER v2.0 board: the module is clamped in an LGA662 socket, so it can be exchanged in seconds without soldering.
How does it differ from the RNX-iMX93-SMARC?
Same processor and memory. The OSM version is 45 x 45 mm and soldered; it brings out up to five UARTs and four PWM signals. The SMARC version is 82 x 50 mm and pluggable, with Ethernet PHYs on the module.
Where can I buy the RNX-iMX93-OSM in Israel?
Pertech is a Ronetix distributor in Israel. Contact Pertech for a quote, lead time, memory and temperature options, or help choosing a module and carrier board.
Related Ronetix products at Pertech
- RNX-iMX93-SMARC SoM with NXP i.MX93
- RNX-OSM-CARRIER v2.0 board
- RNX-OSM-CARRIER board
- RNX-RZG2UL-OSM SoM with Renesas RZ/G2UL, RZ/A3UL or RZ/Five
- Ronetix products at Pertech
Designing a compact i.MX93 product? Contact Pertech for a quote, availability or help choosing the right module.
